3- D IC’s

The three dimensional (3-D) chip design strategy exploits the vertical dimension to alleviate the interconnect related problems and to facilitate heterogeneous integration of technologies to realize system on a chip (SoC) design. By simply dividing a planar chip into separate blocks, each occupying a separate physical level interconnected by short and vertical interlayer interconnects (VILICs), significant improvement in performance and reduction in wire-limited chip area can be achieved.

In the 3-Ddesign architecture, an entire chip is divided into a number of blocks, and each block is placed on a separate layer of Si that are stacked on top of each other.

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